A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
INORGANIC BOARD, CEILING FINISHING MATERIAL, CEILING STRUCTURE, AND METHOD FOR PRODUCING INORGANIC BOARD
To provide an inorganic board A, in which the inorganic board A is made less likely to be bent by effectively suppressing the inhibition of binding function from binding material in inorganic board A by water content.SOLUTION: The inorganic board A contains an inorganic fiber material by 70 to 80 wt.%, an inorganic powder by 13 to 26 wt.%, and a binding material containing a water-based adhesive, whose binding strength decreases due to absorption of moisture or water content, as a main component by 4 to 7 wt.%, and in which the inorganic powder among them contains, as a moisture conditioning inorganic powder having a moisture conditioning property, B-type silica gel by 4 to 12 wt.% per total of inorganic board A.SELECTED DRAWING: Figure 10
【課題】無機質板Ａ中の結合材による結合機能が水分により阻害されるのを有効に抑制して、無機質板Ａを撓み難くする。【解決手段】無機質板Ａは、無機繊維材料７０〜８０重量％と、無機粉体１３〜２６重量％と、湿気又は水分の吸収により結合力が低下する水系接着剤を主成分とする結合材４〜７重量％とが含まれ、そのうちの無機粉体は、調湿性のある調湿性無機粉体としてＢ型シリカゲルを無機質板Ａ全体に対し４〜１２重量％含有している。【選択図】図１０
INORGANIC BOARD, CEILING FINISHING MATERIAL, CEILING STRUCTURE, AND METHOD FOR PRODUCING INORGANIC BOARD
To provide an inorganic board A, in which the inorganic board A is made less likely to be bent by effectively suppressing the inhibition of binding function from binding material in inorganic board A by water content.SOLUTION: The inorganic board A contains an inorganic fiber material by 70 to 80 wt.%, an inorganic powder by 13 to 26 wt.%, and a binding material containing a water-based adhesive, whose binding strength decreases due to absorption of moisture or water content, as a main component by 4 to 7 wt.%, and in which the inorganic powder among them contains, as a moisture conditioning inorganic powder having a moisture conditioning property, B-type silica gel by 4 to 12 wt.% per total of inorganic board A.SELECTED DRAWING: Figure 10
【課題】無機質板Ａ中の結合材による結合機能が水分により阻害されるのを有効に抑制して、無機質板Ａを撓み難くする。【解決手段】無機質板Ａは、無機繊維材料７０〜８０重量％と、無機粉体１３〜２６重量％と、湿気又は水分の吸収により結合力が低下する水系接着剤を主成分とする結合材４〜７重量％とが含まれ、そのうちの無機粉体は、調湿性のある調湿性無機粉体としてＢ型シリカゲルを無機質板Ａ全体に対し４〜１２重量％含有している。【選択図】図１０
INORGANIC BOARD, CEILING FINISHING MATERIAL, CEILING STRUCTURE, AND METHOD FOR PRODUCING INORGANIC BOARD
無機質板、天井仕上げ材、天井構造及び無機質板の製造方法
TAMAMURA KOZO (author) / KOTANI TAKUYA (author) / HARA KOHEI (author)
2020-06-04
Patent
Electronic Resource
Japanese
| European Patent Office | 2020