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A platform for research: civil engineering, architecture and urbanism
HEAT INSULATION SANDWICH PANEL AND CURING COMPOSITION USED THEREFOR
To provide a heat insulation sandwich panel excellent in adiabaticity and heat resistance.SOLUTION: There is provided a heat insulation sandwich panel having a heat insulation layer between two surface materials, in which the heat insulation layer is formed from a polyol compound, a foaming agent, a catalyst, a fire retardant containing a phosphinate compound and/or a phosphoro amidate compound, and a polyisocyanate compound.SELECTED DRAWING: None
【課題】断熱性、耐熱性に優れる断熱サンドイッチパネルの提供。【解決手段】２枚の面材の間に、断熱層が積層され、断熱層が、ポリオール化合物、発泡剤、触媒、ホスフィン酸塩化合物及び／またはホスホロアミダート化合物を含む難燃剤、及びポリイソシアネート化合物を含む硬化性組成物から形成される断熱サンドイッチパネル。【選択図】なし
HEAT INSULATION SANDWICH PANEL AND CURING COMPOSITION USED THEREFOR
To provide a heat insulation sandwich panel excellent in adiabaticity and heat resistance.SOLUTION: There is provided a heat insulation sandwich panel having a heat insulation layer between two surface materials, in which the heat insulation layer is formed from a polyol compound, a foaming agent, a catalyst, a fire retardant containing a phosphinate compound and/or a phosphoro amidate compound, and a polyisocyanate compound.SELECTED DRAWING: None
【課題】断熱性、耐熱性に優れる断熱サンドイッチパネルの提供。【解決手段】２枚の面材の間に、断熱層が積層され、断熱層が、ポリオール化合物、発泡剤、触媒、ホスフィン酸塩化合物及び／またはホスホロアミダート化合物を含む難燃剤、及びポリイソシアネート化合物を含む硬化性組成物から形成される断熱サンドイッチパネル。【選択図】なし
HEAT INSULATION SANDWICH PANEL AND CURING COMPOSITION USED THEREFOR
断熱サンドイッチパネル及びそれに用いる硬化性組成物
AMANO RYOTATO (author)
2020-06-25
Patent
Electronic Resource
Japanese
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C08G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, anders erhalten als durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
/
E04C
STRUCTURAL ELEMENTS
,
Bauelemente
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
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