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THERMOSETTING RESIN COMPOSITION
To provide a thermosetting resin composition which can be cured in a wet space, has good mechanical strength of a cured product, and can suppress deterioration in the mechanical strength even when being brought into contact with water for a long period of time.SOLUTION: The thermosetting resin composition contains a thermosetting resin (A) having a plurality of ethylenically unsaturated bonds, an ethylenically unsaturated compound (B), a thiol compound (C), a metal complex (D), an inorganic aggregate (E) and water (F). A content of a surface active agent with respect to 100 pts.mass of the total mass of the thermosetting resin (A), the ethylenically unsaturated compound (B) and the water (F) is 0 pt.mass or more and less than 0.05 pt.mass. A content of the water (F) with respect to 100 pts.mass of the total content of the thermosetting resin (A) and the ethylenically unsaturated compound (B) is 0.5 pt.mass or more and less than 5 pts.mass.SELECTED DRAWING: None
【課題】湿潤空間で硬化させることができ、硬化物の機械強度が良好であり、かつ水と長期間接触しても機械強度の低下を抑制することができる、熱硬化性樹脂組成物を提供する。【解決手段】エチレン性不飽和結合を複数個有する熱硬化性樹脂(A)、エチレン性不飽和化合物(B)、チオール化合物(C)、金属錯体(D)、無機骨材(E)、及び水(F)を含有し、前記熱硬化性樹脂(A)、前記エチレン性不飽和化合物(B)、及び前記水(F)の合計含有量100質量部に対する界面活性剤の含有量が0質量部以上0.05質量部未満であり、前記熱硬化性樹脂(A)及び前記エチレン性不飽和化合物(B)の合計含有量100質量部に対する前記水(F)の含有量が0.5質量部以上5質量部未満である、熱硬化性樹脂組成物。【選択図】なし
THERMOSETTING RESIN COMPOSITION
To provide a thermosetting resin composition which can be cured in a wet space, has good mechanical strength of a cured product, and can suppress deterioration in the mechanical strength even when being brought into contact with water for a long period of time.SOLUTION: The thermosetting resin composition contains a thermosetting resin (A) having a plurality of ethylenically unsaturated bonds, an ethylenically unsaturated compound (B), a thiol compound (C), a metal complex (D), an inorganic aggregate (E) and water (F). A content of a surface active agent with respect to 100 pts.mass of the total mass of the thermosetting resin (A), the ethylenically unsaturated compound (B) and the water (F) is 0 pt.mass or more and less than 0.05 pt.mass. A content of the water (F) with respect to 100 pts.mass of the total content of the thermosetting resin (A) and the ethylenically unsaturated compound (B) is 0.5 pt.mass or more and less than 5 pts.mass.SELECTED DRAWING: None
【課題】湿潤空間で硬化させることができ、硬化物の機械強度が良好であり、かつ水と長期間接触しても機械強度の低下を抑制することができる、熱硬化性樹脂組成物を提供する。【解決手段】エチレン性不飽和結合を複数個有する熱硬化性樹脂(A)、エチレン性不飽和化合物(B)、チオール化合物(C)、金属錯体(D)、無機骨材(E)、及び水(F)を含有し、前記熱硬化性樹脂(A)、前記エチレン性不飽和化合物(B)、及び前記水(F)の合計含有量100質量部に対する界面活性剤の含有量が0質量部以上0.05質量部未満であり、前記熱硬化性樹脂(A)及び前記エチレン性不飽和化合物(B)の合計含有量100質量部に対する前記水(F)の含有量が0.5質量部以上5質量部未満である、熱硬化性樹脂組成物。【選択図】なし
THERMOSETTING RESIN COMPOSITION
熱硬化性樹脂組成物
USAMI AKIRA (author) / NISHIJIMA DAISUKE (author) / YAMAUCHI SHINTARO (author)
2021-06-03
Patent
Electronic Resource
Japanese
IPC:
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C04B
Kalk
,
LIME
/
C08G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, anders erhalten als durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
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