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SINTERED SILICON NITRIDE BODY, SILICON NITRIDE SUBSTRATE, SILICON NITRIDE CIRCUIT BOARD USING THE SAME, AND SEMICONDUCTOR DEVICE
To provide a sintered silicon nitride body capable of increasing the strength of bonding with metal parts.SOLUTION: A sintered silicon nitride body having an oxide layer 3 at least partly on its surface 2, which is characterized in that, when subjected to the XRD analysis, the surface 2 of the sintered silicon nitride body having thereon an oxide layer 3 gives the strongest peak at a diffraction angle of 21.7 ± 0.3° (which is defined as peak I21.7) and peaks based on silicon nitride crystal particles (the strongest peak based on silicon nitride crystal particles is defined as peak ISiN), and wherein the ratio of I21.7/ISiN is 0.02 to 0.40. The oxide layer 3 preferably contains cristobalite.SELECTED DRAWING: Figure 1
【課題】金属部との接合強度を高めることができる窒化珪素焼結体を提供する。【解決手段】少なくとも一部の表面2に酸化物層3を有する窒化珪素焼結体において、酸化物層3を有する焼結体表面2をXRD分析したとき、回折角21.7±0.3°に検出される最強ピークをI21.7、窒化珪素結晶粒子に基づく最強ピークをISiNとし、その比であるI21.7/ISiNが0.02以上0.40以下であることを特徴とする。また、酸化物層3はクリストバライトを含有することが好ましい。【選択図】図1
SINTERED SILICON NITRIDE BODY, SILICON NITRIDE SUBSTRATE, SILICON NITRIDE CIRCUIT BOARD USING THE SAME, AND SEMICONDUCTOR DEVICE
To provide a sintered silicon nitride body capable of increasing the strength of bonding with metal parts.SOLUTION: A sintered silicon nitride body having an oxide layer 3 at least partly on its surface 2, which is characterized in that, when subjected to the XRD analysis, the surface 2 of the sintered silicon nitride body having thereon an oxide layer 3 gives the strongest peak at a diffraction angle of 21.7 ± 0.3° (which is defined as peak I21.7) and peaks based on silicon nitride crystal particles (the strongest peak based on silicon nitride crystal particles is defined as peak ISiN), and wherein the ratio of I21.7/ISiN is 0.02 to 0.40. The oxide layer 3 preferably contains cristobalite.SELECTED DRAWING: Figure 1
【課題】金属部との接合強度を高めることができる窒化珪素焼結体を提供する。【解決手段】少なくとも一部の表面2に酸化物層3を有する窒化珪素焼結体において、酸化物層3を有する焼結体表面2をXRD分析したとき、回折角21.7±0.3°に検出される最強ピークをI21.7、窒化珪素結晶粒子に基づく最強ピークをISiNとし、その比であるI21.7/ISiNが0.02以上0.40以下であることを特徴とする。また、酸化物層3はクリストバライトを含有することが好ましい。【選択図】図1
SINTERED SILICON NITRIDE BODY, SILICON NITRIDE SUBSTRATE, SILICON NITRIDE CIRCUIT BOARD USING THE SAME, AND SEMICONDUCTOR DEVICE
窒化珪素焼結体、窒化珪素基板およびそれを用いた窒化珪素回路基板並びに半導体装置
AOKI KATSUYUKI (author) / SANO SHOYA (author) / TAKANO HIROAKI (author) / FUKAZAWA TAKAYUKI (author)
2021-06-17
Patent
Electronic Resource
Japanese
Silicon nitride sintered body, silicon nitride substrate, and silicon nitride circuit board
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