A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
HEXAGONAL BORON NITRIDE POWDER, AND SINTERED BODY RAW MATERIAL COMPOSITION
To provide a hexagonal boron nitride powder that makes it possible to produce a sintered body having excellent Shore hardness relative to the density.SOLUTION: The present disclosure provides a powder that contains hexagonal boron nitride and has, in electron microscopic image analysis, the value of B/A of 5.0 or less where A is an average major axis of the primary particles and B is an arithmetic average value of the major axes for the primary particles with the major axes in the top 5%.SELECTED DRAWING: Figure 1
【課題】密度に対するショア硬さに優れる焼結体を製造可能な六方晶窒化ホウ素粉末を提供すること。【解決手段】本開示の一側面は、六方晶窒化ホウ素を含み、電子顕微鏡写真の画像解析において、上記一次粒子の平均長径をＡとし、長径が上位５％である一次粒子を対象とした長径の算術平均値をＢとした場合に、Ｂ／Ａの値が５．０以下である、粉末を提供する。【選択図】図１
HEXAGONAL BORON NITRIDE POWDER, AND SINTERED BODY RAW MATERIAL COMPOSITION
To provide a hexagonal boron nitride powder that makes it possible to produce a sintered body having excellent Shore hardness relative to the density.SOLUTION: The present disclosure provides a powder that contains hexagonal boron nitride and has, in electron microscopic image analysis, the value of B/A of 5.0 or less where A is an average major axis of the primary particles and B is an arithmetic average value of the major axes for the primary particles with the major axes in the top 5%.SELECTED DRAWING: Figure 1
【課題】密度に対するショア硬さに優れる焼結体を製造可能な六方晶窒化ホウ素粉末を提供すること。【解決手段】本開示の一側面は、六方晶窒化ホウ素を含み、電子顕微鏡写真の画像解析において、上記一次粒子の平均長径をＡとし、長径が上位５％である一次粒子を対象とした長径の算術平均値をＢとした場合に、Ｂ／Ａの値が５．０以下である、粉末を提供する。【選択図】図１
HEXAGONAL BORON NITRIDE POWDER, AND SINTERED BODY RAW MATERIAL COMPOSITION
六方晶窒化ホウ素粉末、及び焼結体原料組成物
TAKEDA GO (author) / TANAKA TAKAAKI (author)
2021-08-10
Patent
Electronic Resource
Japanese
HEXAGONAL BORON NITRIDE POWDER AND METHOD FOR PRODUCING SINTERED BODY
| European Patent Office | 2022
HEXAGONAL BORON NITRIDE POWDER AND METHOD FOR PRODUCING SINTERED BODY
| European Patent Office | 2023