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HEAT TREATED CERAMIC SUBSTRATE HAVING CERAMIC COATING AND HEAT TREATMENT FOR COATED CERAMICS
To provide a ceramic article including a ceramic coating on a ceramic substrate that does not cause particle contamination, surface peeling, etc. even when exposed to plasma etching such as in semiconductor processes.SOLUTION: A ceramic article prepared by a process comprising the steps of forming a coating of (a) solid solution of Y2O3-ZrO2 or (b) solid solution of Y4Al2O9 and Y2O3-ZrO2 on a ceramic substrate by thermal spraying process, and then heating the ceramic article to a temperature range between 1000°C and 1800°C; and performing heat treatment of the ceramic article at one or more temperatures within the temperature range for a duration to reduce a porosity of the ceramic coating to below the initial porosity and to reduce an amount of cracking of the ceramic coating to below the initial amount of cracking, wherein the ceramic article is heat treated at below a sintering temperature for the ceramic coating to prevent sintering of the ceramic coating.SELECTED DRAWING: Figure 2B
【課題】半導体プロセスなどのプラズマエッチングにさらされても、粒子汚染や表面剥離等を生じることの無い、セラミック基板上のセラミックコーティングとを含むセラミック物品を提供する。【解決手段】セラミック基板上に溶射プロセスによってＹ２Ｏ３−ＺｒＯ２の固溶体、又はＹ４Ａｌ２Ｏ９及びＹ２Ｏ３−ＺｒＯ２の固溶体のコーティングを形成した後、当該セラミック物品を１０００℃から１８００℃の間の温度範囲に加熱する工程と、ある期間、温度範囲内の１つ以上の温度でセラミック物品の熱処理を実行して、セラミックコーティングの空隙率を初期の空隙率未満に低減させ、セラミックコーティングのクラック量を初期のクラック量未満に低減させる工程であって、セラミック物品は、セラミックコーティングの焼結を防ぐために、セラミックコーティングの焼結温度より低い温度で熱処理される工程と、を含むプロセスによって用意された、セラミック物品。【選択図】図２Ｂ
HEAT TREATED CERAMIC SUBSTRATE HAVING CERAMIC COATING AND HEAT TREATMENT FOR COATED CERAMICS
To provide a ceramic article including a ceramic coating on a ceramic substrate that does not cause particle contamination, surface peeling, etc. even when exposed to plasma etching such as in semiconductor processes.SOLUTION: A ceramic article prepared by a process comprising the steps of forming a coating of (a) solid solution of Y2O3-ZrO2 or (b) solid solution of Y4Al2O9 and Y2O3-ZrO2 on a ceramic substrate by thermal spraying process, and then heating the ceramic article to a temperature range between 1000°C and 1800°C; and performing heat treatment of the ceramic article at one or more temperatures within the temperature range for a duration to reduce a porosity of the ceramic coating to below the initial porosity and to reduce an amount of cracking of the ceramic coating to below the initial amount of cracking, wherein the ceramic article is heat treated at below a sintering temperature for the ceramic coating to prevent sintering of the ceramic coating.SELECTED DRAWING: Figure 2B
【課題】半導体プロセスなどのプラズマエッチングにさらされても、粒子汚染や表面剥離等を生じることの無い、セラミック基板上のセラミックコーティングとを含むセラミック物品を提供する。【解決手段】セラミック基板上に溶射プロセスによってＹ２Ｏ３−ＺｒＯ２の固溶体、又はＹ４Ａｌ２Ｏ９及びＹ２Ｏ３−ＺｒＯ２の固溶体のコーティングを形成した後、当該セラミック物品を１０００℃から１８００℃の間の温度範囲に加熱する工程と、ある期間、温度範囲内の１つ以上の温度でセラミック物品の熱処理を実行して、セラミックコーティングの空隙率を初期の空隙率未満に低減させ、セラミックコーティングのクラック量を初期のクラック量未満に低減させる工程であって、セラミック物品は、セラミックコーティングの焼結を防ぐために、セラミックコーティングの焼結温度より低い温度で熱処理される工程と、を含むプロセスによって用意された、セラミック物品。【選択図】図２Ｂ
HEAT TREATED CERAMIC SUBSTRATE HAVING CERAMIC COATING AND HEAT TREATMENT FOR COATED CERAMICS
セラミックコーティングを有する熱処理されたセラミック基板及びコートされたセラミックスへの熱処理
JENNIFER Y SUN (author) / DUAN REN-GUAN (author) / BIRAJA R KANUNGO (author) / DMITRY LUBOMIRSKY (author)
2021-08-19
Patent
Electronic Resource
Japanese
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