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BRAZING FILLER METAL AND METHOD OF MANUFACTURING THE SAME, AND METAL-CERAMIC BONDING SUBSTRATE
To provide a brazing filler metal for joining a metal plate and a ceramic substrate, which establishes compatibility between excellent thermal shock resistance and a small joint defect such as a void and an unjoined state, in a metal-ceramic bonding substrate, and the related art.SOLUTION: A paste-like brazing filler metal includes a vehicle, and powder that includes 0.7-2.0 mass% of titanium powder with an average particle diameter (D50) of 20 μm or less, 3-15 mass% of copper powder and silver powder as the remnant. The related art is also provided.SELECTED DRAWING: None
【課題】金属−セラミックス接合基板において、ボイドや未接合などの接合欠陥が小さく、且つ優れた耐熱衝撃性を両立する、金属板とセラミックス基板の接合用のろう材およびその関連技術を提供する。【解決手段】平均粒径（Ｄ５０）が２０μｍ以下であるチタン粉を０．７〜２．０質量％、銅粉を３〜１５質量％、残部として銀粉を含む粉体と、ビヒクルとを含むペースト状のろう材およびその関連技術を提供する。【選択図】なし
BRAZING FILLER METAL AND METHOD OF MANUFACTURING THE SAME, AND METAL-CERAMIC BONDING SUBSTRATE
To provide a brazing filler metal for joining a metal plate and a ceramic substrate, which establishes compatibility between excellent thermal shock resistance and a small joint defect such as a void and an unjoined state, in a metal-ceramic bonding substrate, and the related art.SOLUTION: A paste-like brazing filler metal includes a vehicle, and powder that includes 0.7-2.0 mass% of titanium powder with an average particle diameter (D50) of 20 μm or less, 3-15 mass% of copper powder and silver powder as the remnant. The related art is also provided.SELECTED DRAWING: None
【課題】金属−セラミックス接合基板において、ボイドや未接合などの接合欠陥が小さく、且つ優れた耐熱衝撃性を両立する、金属板とセラミックス基板の接合用のろう材およびその関連技術を提供する。【解決手段】平均粒径（Ｄ５０）が２０μｍ以下であるチタン粉を０．７〜２．０質量％、銅粉を３〜１５質量％、残部として銀粉を含む粉体と、ビヒクルとを含むペースト状のろう材およびその関連技術を提供する。【選択図】なし
BRAZING FILLER METAL AND METHOD OF MANUFACTURING THE SAME, AND METAL-CERAMIC BONDING SUBSTRATE
ろう材およびその製造方法並びに金属−セラミックス接合基板の製造方法
OZAKI AYUMI (author)
2021-10-11
Patent
Electronic Resource
Japanese
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