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METHOD FOR PATTERNING RAPED-OFF WALL SURFACE
To provide a method for patterning a scraped-off wall surface that can form sharp uneven patterns and does not allow a residue of topcoat material created by scraping to adhere to formed recesses.SOLUTION: A method for patterning a scraped-off wall surface includes the steps of: attaching a patterning member 40a with a release portion 42 laminated on an adhesive portion 41 to a surface of a wall substrate 10; applying a top coating material 30 to the wall substrate 10; scraping off exposed surfaces of the top coating material 30 and the release portion 42 when a coating film of the top coating material 30 is in a semi-cured state; and removing the patterning member 40a.SELECTED DRAWING: Figure 1
【課題】シャープな凹凸模様を形成することができるとともに、掻き落としで生じる上塗材の滓が形成された凹部に付着することもない掻き落とし壁面の模様付け方法を提供する。【解決手段】掻き落とし壁面の模様付け方法は、粘着部41に離型部42が積層された模様付け部材40aを壁下地10表面に貼り付ける工程と、上塗材30を壁下地10に塗布する工程と、上塗材30の塗膜が半硬化の状態のときに上塗材30及び離型部42の露出面を掻き落とす工程と、模様付け部材40aを取り除く工程と、を備える。【選択図】図1
METHOD FOR PATTERNING RAPED-OFF WALL SURFACE
To provide a method for patterning a scraped-off wall surface that can form sharp uneven patterns and does not allow a residue of topcoat material created by scraping to adhere to formed recesses.SOLUTION: A method for patterning a scraped-off wall surface includes the steps of: attaching a patterning member 40a with a release portion 42 laminated on an adhesive portion 41 to a surface of a wall substrate 10; applying a top coating material 30 to the wall substrate 10; scraping off exposed surfaces of the top coating material 30 and the release portion 42 when a coating film of the top coating material 30 is in a semi-cured state; and removing the patterning member 40a.SELECTED DRAWING: Figure 1
【課題】シャープな凹凸模様を形成することができるとともに、掻き落としで生じる上塗材の滓が形成された凹部に付着することもない掻き落とし壁面の模様付け方法を提供する。【解決手段】掻き落とし壁面の模様付け方法は、粘着部41に離型部42が積層された模様付け部材40aを壁下地10表面に貼り付ける工程と、上塗材30を壁下地10に塗布する工程と、上塗材30の塗膜が半硬化の状態のときに上塗材30及び離型部42の露出面を掻き落とす工程と、模様付け部材40aを取り除く工程と、を備える。【選択図】図1
METHOD FOR PATTERNING RAPED-OFF WALL SURFACE
掻き落とし壁面の模様付け方法
MIYAGI TAKASHI (author) / MIYAKE NAOKI (author) / YOSHIDA KAZUHIKO (author)
2022-09-06
Patent
Electronic Resource
Japanese
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
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Ausbau von Bauwerken, z.B. Treppen, Fußböden
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