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DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT
To provide a dielectric composition with high fracture toughness strength and a multilayer ceramic electronic component containing the dielectric composition.SOLUTION: A dielectric composition according to the present invention includes dielectric particles containing a perovskite compound, and first segregation containing at least Ca, Al, Si, and O.SELECTED DRAWING: Figure 2
【課題】破壊靭性強度の高い誘電体組成物、および、当該誘電体組成物を含む積層セラミック電子部品を提供すること。【解決手段】本発明に係る誘電体組成物は、ペロブスカイト型化合物を含む誘電体粒子と、少なくともＣａ、Ａｌ、Ｓｉ、およびＯを含む第１偏析と、を有する。【選択図】図２
DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT
To provide a dielectric composition with high fracture toughness strength and a multilayer ceramic electronic component containing the dielectric composition.SOLUTION: A dielectric composition according to the present invention includes dielectric particles containing a perovskite compound, and first segregation containing at least Ca, Al, Si, and O.SELECTED DRAWING: Figure 2
【課題】破壊靭性強度の高い誘電体組成物、および、当該誘電体組成物を含む積層セラミック電子部品を提供すること。【解決手段】本発明に係る誘電体組成物は、ペロブスカイト型化合物を含む誘電体粒子と、少なくともＣａ、Ａｌ、Ｓｉ、およびＯを含む第１偏析と、を有する。【選択図】図２
DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT
誘電体組成物および積層セラミック電子部品。
IGUCHI TOSHIHIRO (author) / NONAKA TOMOAKI (author) / SHOJI TAKESHI (author)
2023-03-29
Patent
Electronic Resource
Japanese
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