A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD, AND JOINED BODY FOR INSULATED CIRCUIT BOARD
To provide a joined body suitable for being joined with a second metal layer and for production control.SOLUTION: A method for manufacturing an insulated circuit board includes: a joined body-forming step of forming a joined body 11 having a first metal layer 41A comprising aluminum or an aluminum alloy, on one surface 101 of an insulating substrate 10; an identification code-forming step of forming an identification code by a laser on a surface 411 of a first metal layer 11A of the joined body 11 opposite to the substrate 10; and a circuit board-forming step of bonding a copper plate 42 made of copper or a copper alloy to a surface 411 of a first metal layer 41A' with the identification sign by solid phase diffusion bonding to form an insulated circuit board having a second metal layer, wherein: at least a portion of the identification code is formed as a recess part in the identification code-forming step; and in the circuit board-forming step, a load is applied in a thickness direction of a laminate formed by having a copper plate 42 stacked on the first metal layer 41A' of the joined body 11' and the laminate is heated, to deform the recess part of the first metal layer 41A' and bond it to the second metal layer 42A.SELECTED DRAWING: Figure 2
【課題】本発明は、第二金属層との接合と生産管理とに適した接合体を提供する。【解決手段】絶縁性の基板１０の一方の面１０１に、アルミニウム又はアルミニウム合金から成る第一金属層４１Ａを有する接合体１１を形成する接合体形成工程と、接合体１１の第一金属層１１Ａの基板１０とは反対側の面４１１にレーザーによって識別符号を形成する識別符号形成工程と、第一金属層４１Ａ′の識別符号が設けられた面４１１に銅又は銅合金から成る銅板４２を固相拡散接合によって接合して、第二金属層を有する絶縁回路基板を形成する回路基板形成工程と、を備え、識別符号形成工程は、識別符号の少なくとも一部を凹部として形成し、回路基板形成工程では、接合体１１′の第一金属層４１Ａ′に銅板４２を重ねて成る積層体の厚み方向に荷重を加えると共に積層体を加熱することで、第一金属層４１Ａ′の凹部を変形させて第二金属層４２Ａと接合する。【選択図】図２
METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD, AND JOINED BODY FOR INSULATED CIRCUIT BOARD
To provide a joined body suitable for being joined with a second metal layer and for production control.SOLUTION: A method for manufacturing an insulated circuit board includes: a joined body-forming step of forming a joined body 11 having a first metal layer 41A comprising aluminum or an aluminum alloy, on one surface 101 of an insulating substrate 10; an identification code-forming step of forming an identification code by a laser on a surface 411 of a first metal layer 11A of the joined body 11 opposite to the substrate 10; and a circuit board-forming step of bonding a copper plate 42 made of copper or a copper alloy to a surface 411 of a first metal layer 41A' with the identification sign by solid phase diffusion bonding to form an insulated circuit board having a second metal layer, wherein: at least a portion of the identification code is formed as a recess part in the identification code-forming step; and in the circuit board-forming step, a load is applied in a thickness direction of a laminate formed by having a copper plate 42 stacked on the first metal layer 41A' of the joined body 11' and the laminate is heated, to deform the recess part of the first metal layer 41A' and bond it to the second metal layer 42A.SELECTED DRAWING: Figure 2
【課題】本発明は、第二金属層との接合と生産管理とに適した接合体を提供する。【解決手段】絶縁性の基板１０の一方の面１０１に、アルミニウム又はアルミニウム合金から成る第一金属層４１Ａを有する接合体１１を形成する接合体形成工程と、接合体１１の第一金属層１１Ａの基板１０とは反対側の面４１１にレーザーによって識別符号を形成する識別符号形成工程と、第一金属層４１Ａ′の識別符号が設けられた面４１１に銅又は銅合金から成る銅板４２を固相拡散接合によって接合して、第二金属層を有する絶縁回路基板を形成する回路基板形成工程と、を備え、識別符号形成工程は、識別符号の少なくとも一部を凹部として形成し、回路基板形成工程では、接合体１１′の第一金属層４１Ａ′に銅板４２を重ねて成る積層体の厚み方向に荷重を加えると共に積層体を加熱することで、第一金属層４１Ａ′の凹部を変形させて第二金属層４２Ａと接合する。【選択図】図２
METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD, AND JOINED BODY FOR INSULATED CIRCUIT BOARD
絶縁回路基板の製造方法及び絶縁回路基板用接合体
AOKI SHINSUKE (author) / YUMOTO RYOHEI (author) / FUGANE TAKUMI (author)
2023-09-05
Patent
Electronic Resource
Japanese
| European Patent Office | 2020
| European Patent Office | 2018
| European Patent Office | 2023