A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
JUNCTION STRUCTURE
To make it difficult for a connection member to come off from a ceramic member.SOLUTION: A wafer mounting table 10 includes a ceramic member 12 having a wafer mounting surface 12a, an RF electrode 14 embedded in the ceramic member 12 and shaped along the wafer mounting surface 12a, a metal connection member 16 buried so as to reach the RF electrode 14 from the surface of the ceramic member 12 opposite to the wafer mounting surface 12a, and a metal external current-carrying member 18 that is bonded to the surface of the connection member 16 that is exposed to the outside through a bonding layer 20. The surface of the connection member 16 has an arithmetic mean roughness Ra of 6 to 16 μm.SELECTED DRAWING: Figure 1
【課題】接続部材がセラミック部材から抜け難くする。【解決手段】ウエハ載置台１０は、ウエハ載置面１２ａを備えたセラミック部材１２と、セラミック部材１２に埋設されウエハ載置面１２ａに沿う形状のＲＦ電極１４と、セラミック部材１２のうちウエハ載置面１２ａとは反対側の面からＲＦ電極１４に達するように埋設された金属製の接続部材１６と、接続部材１６のうち外部に露出している面に接合層２０を介して接合された金属製の外部通電部材１８と、を備える。接続部材１６は、表面の算術平均粗さＲａが６～１６μｍである。【選択図】図１
JUNCTION STRUCTURE
To make it difficult for a connection member to come off from a ceramic member.SOLUTION: A wafer mounting table 10 includes a ceramic member 12 having a wafer mounting surface 12a, an RF electrode 14 embedded in the ceramic member 12 and shaped along the wafer mounting surface 12a, a metal connection member 16 buried so as to reach the RF electrode 14 from the surface of the ceramic member 12 opposite to the wafer mounting surface 12a, and a metal external current-carrying member 18 that is bonded to the surface of the connection member 16 that is exposed to the outside through a bonding layer 20. The surface of the connection member 16 has an arithmetic mean roughness Ra of 6 to 16 μm.SELECTED DRAWING: Figure 1
【課題】接続部材がセラミック部材から抜け難くする。【解決手段】ウエハ載置台１０は、ウエハ載置面１２ａを備えたセラミック部材１２と、セラミック部材１２に埋設されウエハ載置面１２ａに沿う形状のＲＦ電極１４と、セラミック部材１２のうちウエハ載置面１２ａとは反対側の面からＲＦ電極１４に達するように埋設された金属製の接続部材１６と、接続部材１６のうち外部に露出している面に接合層２０を介して接合された金属製の外部通電部材１８と、を備える。接続部材１６は、表面の算術平均粗さＲａが６～１６μｍである。【選択図】図１
JUNCTION STRUCTURE
接合構造体
UNNO YUTAKA (author) / TADAKI MIKIYA (author) / YOKONO TAKUYA (author)
2023-10-13
Patent
Electronic Resource
Japanese
JUNCTION STRUCTURE AND ARCHITECTURAL STRUCTURE INCLUDING JUNCTION STRUCTURE
| European Patent Office | 2024
JUNCTION STRUCTURE, JUNCTION METHOD AND JUNCTION METAL FITTING
| European Patent Office | 2017
JUNCTION STRUCTURE, STRUCTURE AND FORMATION METHOD OF JUNCTION STRUCTURE
| European Patent Office | 2020