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HEAT INSULATOR HAVING HOLLOW STRUCTURE FILLED WITH POLYVINYL CHLORIDE RESIN POROUS BODY
To provide a heat insulator having a hollow structure filled with a polyvinyl chloride resin porous body, featuring superior filling efficiency into the hollow structure, along with high heat insulation performance.SOLUTION: The present invention provides a heat insulator composed of a polyvinyl chloride resin porous body and a hollow structure. The hollow structure is filled with the polyvinyl chloride resin porous body.SELECTED DRAWING: None
【課題】 中空構造体への充填性が良く、高い断熱性能を両立する、ポリ塩化ビニル樹脂多孔質体が中空構造体内部に充填された断熱材を提供する。【解決手段】 ポリ塩化ビニル樹脂多孔質体と中空構造体とからなる断熱材であって、前記ポリ塩化ビニル樹脂多孔質体が中空構造体内部に充填されていることを特徴とする、断熱材。【選択図】なし
HEAT INSULATOR HAVING HOLLOW STRUCTURE FILLED WITH POLYVINYL CHLORIDE RESIN POROUS BODY
To provide a heat insulator having a hollow structure filled with a polyvinyl chloride resin porous body, featuring superior filling efficiency into the hollow structure, along with high heat insulation performance.SOLUTION: The present invention provides a heat insulator composed of a polyvinyl chloride resin porous body and a hollow structure. The hollow structure is filled with the polyvinyl chloride resin porous body.SELECTED DRAWING: None
【課題】 中空構造体への充填性が良く、高い断熱性能を両立する、ポリ塩化ビニル樹脂多孔質体が中空構造体内部に充填された断熱材を提供する。【解決手段】 ポリ塩化ビニル樹脂多孔質体と中空構造体とからなる断熱材であって、前記ポリ塩化ビニル樹脂多孔質体が中空構造体内部に充填されていることを特徴とする、断熱材。【選択図】なし
HEAT INSULATOR HAVING HOLLOW STRUCTURE FILLED WITH POLYVINYL CHLORIDE RESIN POROUS BODY
中空構造体内部にポリ塩化ビニル樹脂多孔質体が充填されてなる断熱材
UMEZAKI MASAKAZU (author) / MATSUNAGA TAKAHIRO (author)
2024-05-16
Patent
Electronic Resource
Japanese
POLYVINYL CHLORIDE RESIN COMPOSITION AND POLYVINYL CHLORIDE RESIN SHEET
European Patent Office | 2017
|POLYVINYL CHLORIDE RESIN COMPOSITION AND POLYVINYL CHLORIDE RESIN SHEET
European Patent Office | 2017
|