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A platform for research: civil engineering, architecture and urbanism
Module bonding structure and bonding structure bonding process
The present invention relates to a module joint structure and a joint structure joint process for fixing a module to the foundation concrete by using a connecting iron piece and an anchor bolt by seating the module on the foundation concrete. The module joint structure comprises: foundation concrete formed on the ground; a plurality of foundation anchor bolts embedded in the foundation concrete; leveling nuts coupled to the foundation anchor bolts; a base plate formed of a square plate; non-shrinkable mortar filling the space between the base plate and the foundation concrete; a module frame formed to be seated and fixed on the base plate; bolt fastening holes formed on one side of at a lower portion of the module frame; a connecting iron piece; module fixing bolts; and iron piece fixing bolts.
본 발명은 기초콘크리트에 모듈을 안착하여 연결철편과 앙카볼트를 이용하여 기초콘크리트에 모듈을 고정시키기 위한 모듈 접합구조 및 접합구조 접합공정에 대한 것이다.
Module bonding structure and bonding structure bonding process
The present invention relates to a module joint structure and a joint structure joint process for fixing a module to the foundation concrete by using a connecting iron piece and an anchor bolt by seating the module on the foundation concrete. The module joint structure comprises: foundation concrete formed on the ground; a plurality of foundation anchor bolts embedded in the foundation concrete; leveling nuts coupled to the foundation anchor bolts; a base plate formed of a square plate; non-shrinkable mortar filling the space between the base plate and the foundation concrete; a module frame formed to be seated and fixed on the base plate; bolt fastening holes formed on one side of at a lower portion of the module frame; a connecting iron piece; module fixing bolts; and iron piece fixing bolts.
본 발명은 기초콘크리트에 모듈을 안착하여 연결철편과 앙카볼트를 이용하여 기초콘크리트에 모듈을 고정시키기 위한 모듈 접합구조 및 접합구조 접합공정에 대한 것이다.
Module bonding structure and bonding structure bonding process
모듈 접합구조 및 접합구조 접합공정
KIM INHAN (author) / LEE HOJUN (author) / LEE MINSEOB (author) / KIM EUNSOOK (author) / YOON DOOYUNG (author)
2023-03-06
Patent
Electronic Resource
Korean
IPC:
E02D
FOUNDATIONS
,
Gründungen
| European Patent Office | 2024