A platform for research: civil engineering, architecture and urbanism
The present invention relates to an insulation gypsum board which can directly be constructed without a pretreatment work to insert an insulating material. The insulation gypsum board comprises: an insulating material inserted into a wall framework; and a gypsum board which the insulating material is bonded to. The gypsum board and the insulating material are coupled with an adhesive means.
The present invention relates to an insulation gypsum board which can directly be constructed without a pretreatment work to insert an insulating material. The insulation gypsum board comprises: an insulating material inserted into a wall framework; and a gypsum board which the insulating material is bonded to. The gypsum board and the insulating material are coupled with an adhesive means.
GYPSUM BOARD INSULATION
KANG TAE YOUNG (author)
2015-09-02
Patent
Electronic Resource
Korean
Method for improving heat insulation performance of gypsum board and gypsum board
European Patent Office | 2024
|