A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
BARRIER FILMS AND VACUUM INSULATED PANELS EMPLOYING SAME
기재, 저 열전도도 유기 층 및 저 열전도도 무기 스택을 갖는 진공 단열 패널 엔벨로프가 제공된다. 저 열전도도 무기 스택은 저 열전도도 비-금속 무기 재료 및/또는 저 열전도도 금속 재료를 포함할 것이다.
There is provided a vacuum insulation panel envelope having a substrate, a low thermal conductivity organic layer and a low thermal conductivity inorganic stack. The low thermal conductivity inorganic stack will include low thermal conductivity non-metallic inorganic materials and/or low thermal conductivity metallic materials.
BARRIER FILMS AND VACUUM INSULATED PANELS EMPLOYING SAME
기재, 저 열전도도 유기 층 및 저 열전도도 무기 스택을 갖는 진공 단열 패널 엔벨로프가 제공된다. 저 열전도도 무기 스택은 저 열전도도 비-금속 무기 재료 및/또는 저 열전도도 금속 재료를 포함할 것이다.
There is provided a vacuum insulation panel envelope having a substrate, a low thermal conductivity organic layer and a low thermal conductivity inorganic stack. The low thermal conductivity inorganic stack will include low thermal conductivity non-metallic inorganic materials and/or low thermal conductivity metallic materials.
BARRIER FILMS AND VACUUM INSULATED PANELS EMPLOYING SAME
배리어 필름 및 이를 채용하는 진공 단열 패널
LYONS CHRISTOPHER S (author) / BANGE DONNA W (author) / BEDOYA CEDRIC (author) / ENGEN PAUL T (author) / HOGERTON PETER B (author) / PIEPER JOSEPH M (author) / PRESZLER PRINCE AMY (author) / YU TA HUA (author) / NIE QIHONG (author) / MCCLURE DONALD J (author)
2016-08-23
Patent
Electronic Resource
Korean
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
F16L
PIPES
,
Rohre
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