A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Floor structure to prevent noise between floors of buildings
본 발명은 층간소음 방지 바닥구조에 관한 것으로, 상면에 배관홈(120)이 형성되어 난방관을 배관할 수 있는 패널(100)과, 상기 패널(100) 하부에 형성되어 탄성적으로 충격을 흡수하는 충격흡수장치(200)를 포함하여 건축물의 바닥을 형성함으로써, 비교적 간단한 건식 공정을 통해 난방관을 배관할 수 있으면서도 충격을 흡수하여 층간소음을 효과적으로 감소시킬 수 있는 바닥을 형성할 수 있게 되는 층간소음 방지 바닥구조에 관한 것이다.
The present invention relates to a floor structure for preventing inter-floor noise, which forms the floor of a building by comprising: a panel (100) having piping grooves (120) formed on the upper surface for installing heating pipes, and a shock absorbing device (200) formed on the lower surface of the panel (100) for elastically absorbing shocks, such that the present invention can form a floor that can effectively reduce inter-floor noise by absorbing shocks while enabling heating pipes to be installed through a relatively simple dry process.
Floor structure to prevent noise between floors of buildings
본 발명은 층간소음 방지 바닥구조에 관한 것으로, 상면에 배관홈(120)이 형성되어 난방관을 배관할 수 있는 패널(100)과, 상기 패널(100) 하부에 형성되어 탄성적으로 충격을 흡수하는 충격흡수장치(200)를 포함하여 건축물의 바닥을 형성함으로써, 비교적 간단한 건식 공정을 통해 난방관을 배관할 수 있으면서도 충격을 흡수하여 층간소음을 효과적으로 감소시킬 수 있는 바닥을 형성할 수 있게 되는 층간소음 방지 바닥구조에 관한 것이다.
The present invention relates to a floor structure for preventing inter-floor noise, which forms the floor of a building by comprising: a panel (100) having piping grooves (120) formed on the upper surface for installing heating pipes, and a shock absorbing device (200) formed on the lower surface of the panel (100) for elastically absorbing shocks, such that the present invention can form a floor that can effectively reduce inter-floor noise by absorbing shocks while enabling heating pipes to be installed through a relatively simple dry process.
Floor structure to prevent noise between floors of buildings
층간소음 방지 바닥구조
KIM DONG SIK (author)
2024-06-25
Patent
Electronic Resource
Korean
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