A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Low dust additives for joint compounds and joint compounds thereof
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded and also exhibits improved adhesive properties. The dust reduction additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reduction additive comprises micro-crystalline wax or micro-crystalline wax emulsion.
Low dust additives for joint compounds and joint compounds thereof
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded and also exhibits improved adhesive properties. The dust reduction additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reduction additive comprises micro-crystalline wax or micro-crystalline wax emulsion.
Low dust additives for joint compounds and joint compounds thereof
AYAMBEM AMBA (author)
2019-12-24
Patent
Electronic Resource
English
IPC:
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C04B
Kalk
,
LIME
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
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