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Heat-dissipating component and method for manufacturing same
A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.
Heat-dissipating component and method for manufacturing same
A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.
Heat-dissipating component and method for manufacturing same
MIYAKAWA TAKESHI (author) / KINO MOTONORI (author)
2020-12-15
Patent
Electronic Resource
English
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
B22D
CASTING OF METALS
,
Gießen von Metallen
/
C04B
Kalk
,
LIME
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
C22C
Legierungen
,
ALLOYS
/
H05K
PRINTED CIRCUITS
,
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