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Ceramic-aluminum assembly with bonding trenches
An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 μm.
Ceramic-aluminum assembly with bonding trenches
An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 μm.
Ceramic-aluminum assembly with bonding trenches
MARGAVIO PATRICK (author) / ENGLISH KURT (author) / WILSON JACOB (author) / PIZZELLA MIRANDA (author) / BROOKE TODD (author)
2021-01-05
Patent
Electronic Resource
English
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
C04B
Kalk
,
LIME
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES