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Thermal conductive member and heat dissipation structure including the same
A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.
Thermal conductive member and heat dissipation structure including the same
A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.
Thermal conductive member and heat dissipation structure including the same
INOUE SAORI (author) / YAMAGATA TOSHITAKA (author) / MINAKATA YOSHITAKA (author) / YOSHIMATSU RYO (author) / KOGA RYUJI (author)
2021-06-15
Patent
Electronic Resource
English
THERMAL CONDUCTIVE MEMBER AND HEAT DISSIPATION STRUCTURE INCLUDING THE SAME
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