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Ceramic thermal insulation
A heat resistant electronic component is disclosed, comprising an electronic component covered by a layer of ceramic thermal insulation material containing lithium molybdate Li2MoO4. A process for manufacturing the heat resistant electronic component comprises obtaining ceramic thermal insulation material containing lithium molybdate Li2MoO4 in a mouldable form, optionally mixing the ceramic thermal insulation material with at least one additive, covering an electronic component with the material, shaping the material covering the electronic component into a desired form, and drying the desired form at a temperature of from 20° C. to 120° C.
Ceramic thermal insulation
A heat resistant electronic component is disclosed, comprising an electronic component covered by a layer of ceramic thermal insulation material containing lithium molybdate Li2MoO4. A process for manufacturing the heat resistant electronic component comprises obtaining ceramic thermal insulation material containing lithium molybdate Li2MoO4 in a mouldable form, optionally mixing the ceramic thermal insulation material with at least one additive, covering an electronic component with the material, shaping the material covering the electronic component into a desired form, and drying the desired form at a temperature of from 20° C. to 120° C.
Ceramic thermal insulation
HANNU JARI (author) / JUUTI JARI (author) / JANTUNEN HELI (author) / NELO MIKKO (author)
2023-01-10
Patent
Electronic Resource
English
| European Patent Office | 2020