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A platform for research: civil engineering, architecture and urbanism
Ferrite particles for bonded magnets, resin composition for bonded magnets, and molded product using the same
According to the present invention, there are provided ferrite particles for bonded magnets and a resin composition for bonded magnets which are capable of producing a bonded magnet molded product having a good tensile elongation and exhibiting excellent magnetic properties, as well as a bonded magnet molded product such as a rotor which is obtained by using the resin composition. The present invention relates to ferrite particles for bonded magnets having a bulk density of not less than 0.5 g/cm3 and less than 0.6 g/cm3 and a degree of compaction of not less than 65%, a resin composition for bonded magnets using the ferrite particles, and a molded product obtained by using the ferrite particles and the resin composition.
Ferrite particles for bonded magnets, resin composition for bonded magnets, and molded product using the same
According to the present invention, there are provided ferrite particles for bonded magnets and a resin composition for bonded magnets which are capable of producing a bonded magnet molded product having a good tensile elongation and exhibiting excellent magnetic properties, as well as a bonded magnet molded product such as a rotor which is obtained by using the resin composition. The present invention relates to ferrite particles for bonded magnets having a bulk density of not less than 0.5 g/cm3 and less than 0.6 g/cm3 and a degree of compaction of not less than 65%, a resin composition for bonded magnets using the ferrite particles, and a molded product obtained by using the ferrite particles and the resin composition.
Ferrite particles for bonded magnets, resin composition for bonded magnets, and molded product using the same
NISHIO YASUSHI (author) / SAKURAI HIROMITSU (author) / FUKUSHINA NORIHIRO (author) / FUJII YASUHIKO (author)
2023-11-21
Patent
Electronic Resource
English
IPC:
H01F
MAGNETS
,
Magnete
/
C01G
Verbindungen der von den Unterklassen C01D oder C01F nicht umfassten Metalle
,
COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
| European Patent Office | 2023
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