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A platform for research: civil engineering, architecture and urbanism
Method for foaming chipboards with tubes and a chipboard with tubes
The invention relates to a method for foaming chipboard with tubes including a board body interspersed by tubes and having an upper and a lower face includes the steps ofproviding a corresponding chipboard with tubes,defining one or more machining regions on the upper and/or lower face of the chipboard with tubes,machining the machining regions.In order to provide a method for foaming chipboard with tubes and a chipboard with tubes having foamed tubes that can be used in a simple, flexible, and cost-effective manner while also being highly robust, a foam-forming material is introduced at least in portions of at least one of the above-mentioned tubes in the machining region in order to locally reduce the difference in density between the tubes and the board body. The invention further relates to the use of a device for foaming tubes of a chipboard with tubes.
Method for foaming chipboards with tubes and a chipboard with tubes
The invention relates to a method for foaming chipboard with tubes including a board body interspersed by tubes and having an upper and a lower face includes the steps ofproviding a corresponding chipboard with tubes,defining one or more machining regions on the upper and/or lower face of the chipboard with tubes,machining the machining regions.In order to provide a method for foaming chipboard with tubes and a chipboard with tubes having foamed tubes that can be used in a simple, flexible, and cost-effective manner while also being highly robust, a foam-forming material is introduced at least in portions of at least one of the above-mentioned tubes in the machining region in order to locally reduce the difference in density between the tubes and the board body. The invention further relates to the use of a device for foaming tubes of a chipboard with tubes.
Method for foaming chipboards with tubes and a chipboard with tubes
HEIM SEBASTIAN (author) / DONATH STEFFEN (author) / KLOESER LARS (author)
2024-08-27
Patent
Electronic Resource
English
IPC:
B27M
Holzbearbeitung, soweit nicht in den Unterklassen B27B-B27L vorgesehen
,
WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B-B27L
/
B27N
Herstellung von Gegenständen im Trockenverfahren, mit oder ohne Zusatz von organischem Bindemittel, aus Spänen oder Fasern, die aus Holz oder anderem lignocellulosehaltigem oder ähnlichem organischen Material bestehen
,
MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
/
B29C
Formen oder Verbinden von Kunststoffen
,
SHAPING OR JOINING OF PLASTICS
/
E04C
STRUCTURAL ELEMENTS
,
Bauelemente
Chipboards with Plasma Protective Decorative Coatings
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| British Library Conference Proceedings | 1994
Design of a New Chipboard-Splitter
| British Library Online Contents | 2011
Wood chipboard - recommendations for use
| TIBKAT | 1985