A platform for research: civil engineering, architecture and urbanism
Electronic device housing, electronic device, and compound body
An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.
Electronic device housing, electronic device, and compound body
An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.
Electronic device housing, electronic device, and compound body
MA LAN (author) / JIN HAIYAN (author) / PAN LING (author) / YU NA (author) / CHEN LIANG (author)
2024-08-27
Patent
Electronic Resource
English
ELECTRONIC DEVICE HOUSING, ELECTRONIC DEVICE, AND COMPOUND BODY
European Patent Office | 2021
|ELECTRONIC DEVICE HOUSING, ELECTRONIC DEVICE, AND COMBINED BODY
European Patent Office | 2021
|ELECTRONIC DEVICE HOUSING, AND ELECTRONIC DEVICE INCLUDING SAME
European Patent Office | 2024
|COOLING HOUSING FOR ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND CONSTRUCTION MACHINE
European Patent Office | 2015
|Cooling housing for electronic device, electronic device, and construction machine
European Patent Office | 2015
|