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HIGH TEMPERATURE WITHSTAND SILVER PLATED SURFACE STRUCTURE FOR HEAT DISSIPATION CERAMIC SUBSTRATE
Disclosed is a high temperature withstand silver plated surface structure for heat dissipation ceramic substrate used to provide a surface for mounting a LED die unit on the surface of the substrate. The surface of the substrate is covered with a silver cover layer composed of a reduction nickel layer, a reduction palladium layer and a reduction silver layer stacked in order, or a reduction nickel layer, a reduction palladium layer and a replacement silver layer stacked in order. With this structure the silver layer on the substrate is able to keep away from deterioration or color change by instantaneous high temperature rise during the process of performing eutectic bonding of the flip chip LED die unit on the substrate, or by high ambient temperature caused by a long term use of the LED die unit so as to stabilize the LED quality.
HIGH TEMPERATURE WITHSTAND SILVER PLATED SURFACE STRUCTURE FOR HEAT DISSIPATION CERAMIC SUBSTRATE
Disclosed is a high temperature withstand silver plated surface structure for heat dissipation ceramic substrate used to provide a surface for mounting a LED die unit on the surface of the substrate. The surface of the substrate is covered with a silver cover layer composed of a reduction nickel layer, a reduction palladium layer and a reduction silver layer stacked in order, or a reduction nickel layer, a reduction palladium layer and a replacement silver layer stacked in order. With this structure the silver layer on the substrate is able to keep away from deterioration or color change by instantaneous high temperature rise during the process of performing eutectic bonding of the flip chip LED die unit on the substrate, or by high ambient temperature caused by a long term use of the LED die unit so as to stabilize the LED quality.
HIGH TEMPERATURE WITHSTAND SILVER PLATED SURFACE STRUCTURE FOR HEAT DISSIPATION CERAMIC SUBSTRATE
CHIANG TSAI-PAO (author) / TSAO MAO-SUNG (author) / YANG HSIH-HSIEN (author)
2016-07-28
Patent
Electronic Resource
English
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