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LOW TEMPERATURE COFIRED CERAMIC MATERIAL, CERAMIC SINTERED BODY, AND CERAMIC ELECTRONIC COMPONENT
A mixed powder for a low temperature cofired ceramic material that contains 65 to 80 parts by weight of SiO2, 5 to 25 parts by weight of BaO, 1 to 10 parts by weight of Al2O3, 0.1 to 5 parts by weight of MnO, 0.1 to 5 parts by weight of B2O3, and 0.1 to less than 3 parts by weight of Li2O. The ceramic sintered body is used for, for example, ceramic electronic components, e.g., a multilayer circuit board or a coupler.
LOW TEMPERATURE COFIRED CERAMIC MATERIAL, CERAMIC SINTERED BODY, AND CERAMIC ELECTRONIC COMPONENT
A mixed powder for a low temperature cofired ceramic material that contains 65 to 80 parts by weight of SiO2, 5 to 25 parts by weight of BaO, 1 to 10 parts by weight of Al2O3, 0.1 to 5 parts by weight of MnO, 0.1 to 5 parts by weight of B2O3, and 0.1 to less than 3 parts by weight of Li2O. The ceramic sintered body is used for, for example, ceramic electronic components, e.g., a multilayer circuit board or a coupler.
LOW TEMPERATURE COFIRED CERAMIC MATERIAL, CERAMIC SINTERED BODY, AND CERAMIC ELECTRONIC COMPONENT
SUGIMOTO YASUTAKA (author) / KANEKO KAZUHIRO (author)
2018-02-15
Patent
Electronic Resource
English
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