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ELECTRONIC DEVICE, HINGE ASSEMBLY AND AUGMENTED REALITY INTERACTION PROCESS FOR ELECTRONIC DEVICE
The invention provides an electronic device, a hinge assembly, and an AR interaction process for an electronic device. The electronic device includes a first body, a second body, a hinge assembly, and a rotatable lens. The hinge assembly includes a first hinge, a second hinge, a third hinge, and an L-shaped hinge. The L-shaped hinge has a first segment and a second segment. The first segment is pivotally connected to the first body through the first hinge, the second segment is pivotally connected to the second body through the second hinge, and the first hinge, the second hinge, and the third hinge are parallel to each other and are not coaxial with each other. In addition, the rotatable lens is assembled to the second segment.
ELECTRONIC DEVICE, HINGE ASSEMBLY AND AUGMENTED REALITY INTERACTION PROCESS FOR ELECTRONIC DEVICE
The invention provides an electronic device, a hinge assembly, and an AR interaction process for an electronic device. The electronic device includes a first body, a second body, a hinge assembly, and a rotatable lens. The hinge assembly includes a first hinge, a second hinge, a third hinge, and an L-shaped hinge. The L-shaped hinge has a first segment and a second segment. The first segment is pivotally connected to the first body through the first hinge, the second segment is pivotally connected to the second body through the second hinge, and the first hinge, the second hinge, and the third hinge are parallel to each other and are not coaxial with each other. In addition, the rotatable lens is assembled to the second segment.
ELECTRONIC DEVICE, HINGE ASSEMBLY AND AUGMENTED REALITY INTERACTION PROCESS FOR ELECTRONIC DEVICE
TZOU JYH-CHYANG (author) / YANG YAO-HSIEN (author) / LIU YI-HSUN (author) / TSENG HSIAO-WEN (author) / CHI CHENG-YA (author)
2019-07-11
Patent
Electronic Resource
English
Electronic device, hinge assembly and augmented reality interaction process for electronic device
European Patent Office | 2021
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