A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
A subfloor leveling assembly for leveling floor paneling on a subfloor includes a subfloor of a floor system in a building. A leveling compound is provided that comprises wood particles that are mixed with a fluid resin. The leveling compound is spread over the subfloor to completely cover the subfloor thereby facilitating the leveling compound to settle through gravity. In this way the leveling compound defines a level surface on the subfloor. Floor paneling is provided and the floor paneling is positionable on the leveling compound when the leveling compound is spread over the subfloor. In this way the floor paneling is leveled on the subfloor.
A subfloor leveling assembly for leveling floor paneling on a subfloor includes a subfloor of a floor system in a building. A leveling compound is provided that comprises wood particles that are mixed with a fluid resin. The leveling compound is spread over the subfloor to completely cover the subfloor thereby facilitating the leveling compound to settle through gravity. In this way the leveling compound defines a level surface on the subfloor. Floor paneling is provided and the floor paneling is positionable on the leveling compound when the leveling compound is spread over the subfloor. In this way the floor paneling is leveled on the subfloor.
SUBFLOOR LEVELING ASSEMBLY
DIAZ JOSE MARIO (author)
2020-05-07
Patent
Electronic Resource
English