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METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE
A metal-ceramic substrate (1) comprisingan insulating layer (11) comprising a ceramic and having a first thickness (D1), anda metallization layer (12) bonded to the insulation layer (11) and having a second thickness (D2),wherein the first thickness (D1) is less than 250 μm and the second thickness (D2) is greater than 200 μm and wherein the first thickness (D1) and the second thickness (D2) are dimensioned such that a ratio ofan amount of the difference between a thermal expansion coefficient of the metallization layer (12) and a thermal expansion coefficient of the metal-ceramic substrate (1) toa thermal expansion coefficient of the metal-ceramic substrate (1)has a value less than 0.25, preferably less than 0.2 and more preferably less than 0.15 or even less than 0.1.
METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE
A metal-ceramic substrate (1) comprisingan insulating layer (11) comprising a ceramic and having a first thickness (D1), anda metallization layer (12) bonded to the insulation layer (11) and having a second thickness (D2),wherein the first thickness (D1) is less than 250 μm and the second thickness (D2) is greater than 200 μm and wherein the first thickness (D1) and the second thickness (D2) are dimensioned such that a ratio ofan amount of the difference between a thermal expansion coefficient of the metallization layer (12) and a thermal expansion coefficient of the metal-ceramic substrate (1) toa thermal expansion coefficient of the metal-ceramic substrate (1)has a value less than 0.25, preferably less than 0.2 and more preferably less than 0.15 or even less than 0.1.
METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE
MEYER ANDREAS (author) / BRITTING STEFAN (author)
2021-06-24
Patent
Electronic Resource
English
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