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A system for underlayment of a flooring has at least two foam panels having and a complementary under step portion on one side an an overstep portion on an opposite side. The understep portion has an adhesive strip with a release liner. The panels are joined by placing the overstep portion of one panel over the understep portion of an adjacent panel and removing the release liner. The overstep portion is then adhered to the overstep portion to seal the panels together. A method of grinding foam strips to form the panels is disclosed.
A system for underlayment of a flooring has at least two foam panels having and a complementary under step portion on one side an an overstep portion on an opposite side. The understep portion has an adhesive strip with a release liner. The panels are joined by placing the overstep portion of one panel over the understep portion of an adjacent panel and removing the release liner. The overstep portion is then adhered to the overstep portion to seal the panels together. A method of grinding foam strips to form the panels is disclosed.
FLOORING UNDERLAYMENT SYSTEM
WISE RONALD (author)
2021-07-29
Patent
Electronic Resource
English
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden