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A platform for research: civil engineering, architecture and urbanism
FLOOR LIFT LAYER PROVIDING RIGIDITY, SOUND REDUCTION, AND THERMAL INSULATION
A floor structure includes a subfloor, a floor covering disposed above the subfloor, and a floor lift layer disposed between the subfloor and the floor covering. The floor covering is disposed above the subfloor. The floor lift layer is a fiber structure that includes a substrate fiber bound together by a thermoplastic binder fiber. The thermoplastic binder fiber makes up between 25 percent (%) and 35% by weight of the floor lift layer.
FLOOR LIFT LAYER PROVIDING RIGIDITY, SOUND REDUCTION, AND THERMAL INSULATION
A floor structure includes a subfloor, a floor covering disposed above the subfloor, and a floor lift layer disposed between the subfloor and the floor covering. The floor covering is disposed above the subfloor. The floor lift layer is a fiber structure that includes a substrate fiber bound together by a thermoplastic binder fiber. The thermoplastic binder fiber makes up between 25 percent (%) and 35% by weight of the floor lift layer.
FLOOR LIFT LAYER PROVIDING RIGIDITY, SOUND REDUCTION, AND THERMAL INSULATION
COLLISON ALAN B (author) / FUELBERTH CARL (author)
2023-08-03
Patent
Electronic Resource
English
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
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