A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Methods for Joining Composite Components to Form a Unitary Composite Component
Methods for joining a first ceramic component to a second ceramic component to form a unitary ceramic component are provided. The method includes positioning a bonding sheet between a first ceramic component and a second ceramic component. The bonding sheet defines a plurality of voids. The method also includes densifying the bonding sheet with an infiltrate composition at a densification temperature to form a bonding interface comprising a ceramic material that forms a bonding interface between the first ceramic component to the second ceramic component into a unitary ceramic component.
Methods for Joining Composite Components to Form a Unitary Composite Component
Methods for joining a first ceramic component to a second ceramic component to form a unitary ceramic component are provided. The method includes positioning a bonding sheet between a first ceramic component and a second ceramic component. The bonding sheet defines a plurality of voids. The method also includes densifying the bonding sheet with an infiltrate composition at a densification temperature to form a bonding interface comprising a ceramic material that forms a bonding interface between the first ceramic component to the second ceramic component into a unitary ceramic component.
Methods for Joining Composite Components to Form a Unitary Composite Component
SHIANG JOSEPH JOHN (author) / WEAVER JARED HOGG (author) / MAGNANT JEROME GEOFFREY (author) / DUNN DANIEL GENE (author)
2024-08-22
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
Methods for joining ceramic components to form unitary ceramic components
| European Patent Office | 2024
METHODS FOR JOINING CERAMIC COMPONENTS TO FORM UNITARY CERAMIC COMPONENTS
| European Patent Office | 2023
METHODS FOR JOINING CERAMIC COMPONENTS TO FORM UNITARY CERAMIC COMPONENTS
| European Patent Office | 2024