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A platform for research: civil engineering, architecture and urbanism
Flexible underfill compositions for enhanced reliability
Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.
Flexible underfill compositions for enhanced reliability
Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.
Flexible underfill compositions for enhanced reliability
XU DINGYING (author) / ANANTHAKRISHNAN NISHA (author) / DONG HONG (author) / MANEPALLI RAHUL N (author) / RARAVIKAR NACHIKET (author) / CONSTABLE GREGORY S (author)
2015-06-30
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
/
C08G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, anders erhalten als durch Reaktionen, an denen nur ungesÃĪttigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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