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Methods for forming feedthroughs for hermetically sealed housings using powder injection molding
Methods of forming feedthroughs for hermetically sealed housings using powder injection molding, including positioning a plurality of separate electrically conductive elements in a mold, injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements, sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements; and severing the conductive elements between neighboring insulative bodies.
Methods for forming feedthroughs for hermetically sealed housings using powder injection molding
Methods of forming feedthroughs for hermetically sealed housings using powder injection molding, including positioning a plurality of separate electrically conductive elements in a mold, injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements, sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements; and severing the conductive elements between neighboring insulative bodies.
Methods for forming feedthroughs for hermetically sealed housings using powder injection molding
PARKER JOHN L (author) / ROBINSON DAVID (author) / THOMAS DAVID (author) / FRETZ MARK (author)
2015-07-07
Patent
Electronic Resource
English
IPC:
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
A61N
ELECTROTHERAPY
,
Elektrotherapie
/
C04B
Kalk
,
LIME
Forming feedthroughs for hermetically sealed housings using two-material powder injection molding
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