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Submicron alpha alumina high temperature bonded abrasives
A high temperature bonded abrasive includes alumina abrasive grits, and a vitreous bond matrix in which the alumina abrasive grits are distributed, the vitreous bond matrix having a cure temperature not less than 1000° C. The alumina abrasive grits include polycrystalline alpha alumina having a fine crystalline microstructure characterized by an alpha alumina average domain size not greater than 500 nm, and the alumina abrasive grits further include a pinning agent that is a dispersed phase in the polycrystalline alpha alumina.
Submicron alpha alumina high temperature bonded abrasives
A high temperature bonded abrasive includes alumina abrasive grits, and a vitreous bond matrix in which the alumina abrasive grits are distributed, the vitreous bond matrix having a cure temperature not less than 1000° C. The alumina abrasive grits include polycrystalline alpha alumina having a fine crystalline microstructure characterized by an alpha alumina average domain size not greater than 500 nm, and the alumina abrasive grits further include a pinning agent that is a dispersed phase in the polycrystalline alpha alumina.
Submicron alpha alumina high temperature bonded abrasives
BAUER RALPH (author) / SKOWRON MARGARET L (author)
2015-09-29
Patent
Electronic Resource
English
Submicron alpha alumina high temperature bonded abrasives
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