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Laminated ceramic electronic component and manufacturing method therefor
A laminated body is divided into a large grain region and a small grain region. The large grain region is located outside the small grain region, and a boundary surface between the regions is located inside the outer surface of the laminated body while surrounding a section in which internal electrodes are present in the laminated body. To obtain the laminated body, firing is carried out with a profile in which the average rate of increase from room to the maximum temperature is 40° C./second or more.
Laminated ceramic electronic component and manufacturing method therefor
A laminated body is divided into a large grain region and a small grain region. The large grain region is located outside the small grain region, and a boundary surface between the regions is located inside the outer surface of the laminated body while surrounding a section in which internal electrodes are present in the laminated body. To obtain the laminated body, firing is carried out with a profile in which the average rate of increase from room to the maximum temperature is 40° C./second or more.
Laminated ceramic electronic component and manufacturing method therefor
HIRATA YOSUKE (author) / TSUJI HIDEAKI (author) / OMORI NAGATO (author) / WADA HIROYUKI (author) / HIRAMATSU TAKASHI (author) / SAITO YOSHITO (author)
2015-11-10
Patent
Electronic Resource
English
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