A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Substrate including a diamond layer and a composite layer of diamond and silicon carbide, and, optionally, silicon
A multilayer substrate includes a diamond layer CVD grown on a composite layer. The composite layer includes particles of diamond and silicon carbide and, optionally, silicon. A loading level (by volume) of diamond in the composite layer can be ≧5%; ≧20%; ≧40%; or ≧60%. The multilayer substrate can be used as an optical device; a detector for detecting radiation particles or electromagnetic waves; a device for cutting, drilling, machining, milling, lapping, polishing, coating, bonding, or brazing; a braking device; a seal; a heat conductor; an electromagnetic wave conductor; a chemically inert device for use in a corrosive environment, a strong oxidizing environment, or a strong reducing environment, at an elevated temperature, or under a cryogenic condition; or a device for polishing or planarization of other devices, wafers or films.
Substrate including a diamond layer and a composite layer of diamond and silicon carbide, and, optionally, silicon
A multilayer substrate includes a diamond layer CVD grown on a composite layer. The composite layer includes particles of diamond and silicon carbide and, optionally, silicon. A loading level (by volume) of diamond in the composite layer can be ≧5%; ≧20%; ≧40%; or ≧60%. The multilayer substrate can be used as an optical device; a detector for detecting radiation particles or electromagnetic waves; a device for cutting, drilling, machining, milling, lapping, polishing, coating, bonding, or brazing; a braking device; a seal; a heat conductor; an electromagnetic wave conductor; a chemically inert device for use in a corrosive environment, a strong oxidizing environment, or a strong reducing environment, at an elevated temperature, or under a cryogenic condition; or a device for polishing or planarization of other devices, wafers or films.
Substrate including a diamond layer and a composite layer of diamond and silicon carbide, and, optionally, silicon
XU WEN-QING (author) / EISSLER ELGIN E (author) / LIU CHAO (author) / TANNER CHARLES D (author) / KRAISINGER CHARLES J (author) / AGHAJANIAN MICHAEL (author)
2016-10-18
Patent
Electronic Resource
English
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C01B
NON-METALLIC ELEMENTS
,
Nichtmetallische Elemente
/
C04B
Kalk
,
LIME
/
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
C30B
SINGLE-CRYSTAL GROWTH
,
Züchten von Einkristallen
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