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Hinge assembly for electronic device
A hinge assembly for an electronic device includes a joint assembly including joint components hinged one by one. Each joint component includes a first plate, a second plate, and a link component disposed between the first and second plates. Each of the first and second plates has two first slots diametrically extending in a first direction. The first plate has a second slot disposed between the two first slots and diametrically extending in a second direction different from the first direction. The second plate has a third slot disposed between the two first slots and diametrically extending in a third direction mirror-symmetrical to the second direction with respect to the first direction. The link component has an engaging hole and a guide portion. The engaging hole is corresponding to one of the first slots of each of the first and second plates, and the guide portion is formed on a surface of the link component and movable within the second or third slot. Movement of the guide portion causes the link component to move, and the engaging hole moves corresponding to the one of the first slots of each of the first and second plates along the first direction, thus changing an axial distance between the shafts.
Hinge assembly for electronic device
A hinge assembly for an electronic device includes a joint assembly including joint components hinged one by one. Each joint component includes a first plate, a second plate, and a link component disposed between the first and second plates. Each of the first and second plates has two first slots diametrically extending in a first direction. The first plate has a second slot disposed between the two first slots and diametrically extending in a second direction different from the first direction. The second plate has a third slot disposed between the two first slots and diametrically extending in a third direction mirror-symmetrical to the second direction with respect to the first direction. The link component has an engaging hole and a guide portion. The engaging hole is corresponding to one of the first slots of each of the first and second plates, and the guide portion is formed on a surface of the link component and movable within the second or third slot. Movement of the guide portion causes the link component to move, and the engaging hole moves corresponding to the one of the first slots of each of the first and second plates along the first direction, thus changing an axial distance between the shafts.
Hinge assembly for electronic device
HUNG SHIN YU (author) / CHU JUI LIN (author)
2018-01-16
Patent
Electronic Resource
English