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Effect of material parameters on dendritic patterns of Ni-Cu binary alloy using phase-field simulation
The effects of various material parameters such as solid diffusivity Ds, anisotropy parameter ε, interface kinetic coefficient β, surface energy σ and cooling rate T̃ on dendritic patterns are investigated by using a phase-field model which couples concentration gradient for three-dimensional simulation of binary alloy solidification. The computed results indicate that, different material parameters lead to different dendritic patterns and severity of microsegregation. The smaller the Ds is, as well as the larger the ε, β, σ, T̃ are, the greater the dendritic tip velocity is, the more developed both the main branch and side-branches are, and the bigger DAS is.
Effect of material parameters on dendritic patterns of Ni-Cu binary alloy using phase-field simulation
The effects of various material parameters such as solid diffusivity Ds, anisotropy parameter ε, interface kinetic coefficient β, surface energy σ and cooling rate T̃ on dendritic patterns are investigated by using a phase-field model which couples concentration gradient for three-dimensional simulation of binary alloy solidification. The computed results indicate that, different material parameters lead to different dendritic patterns and severity of microsegregation. The smaller the Ds is, as well as the larger the ε, β, σ, T̃ are, the greater the dendritic tip velocity is, the more developed both the main branch and side-branches are, and the bigger DAS is.
Effect of material parameters on dendritic patterns of Ni-Cu binary alloy using phase-field simulation
Zhu Changsheng, (author) / Xiao Rongzhen, (author) / Wang Zhiping, (author) / Feng Li, (author)
2009-11-01
244713 byte
Conference paper
Electronic Resource
English
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