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    Punch Through Effects in Evaporated Metal Semiconductor Contacts

    New search for: L. P. Andersson
    New search for: S. Berg
    New search for: N. Boonthanom
    New search for: O. M. Garcia Pacheco

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    Punch Through Effects in Evaporated Metal Semiconductor Contacts

    New search for: L. P. Andersson
    New search for: S. Berg
    New search for: N. Boonthanom
    New search for: O. M. Garcia Pacheco

    Access

    Access via TIB
    Check availability in my library

    Punch Through Effects in Evaporated Metal Semiconductor Contacts

    New search for: L. P. Andersson
    New search for: S. Berg
    New search for: N. Boonthanom
    New search for: O. M. Garcia Pacheco

    Access

    Access via TIB
    Check availability in my library

    Access

    Access via TIB
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    Document information
    Similar titles

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    Document information
    Title:

    Punch Through Effects in Evaporated Metal Semiconductor Contacts

    Contributors:

    L. P. Andersson (author) / S. Berg (author) / N. Boonthanom (author) / O. M. Garcia Pacheco (author)

    Publication date:

    1969

    Size:

    17 pages

    Type of media:

    Report

    Type of material:

    No indication

    Language:

    English

    Keywords:

    Resistive, Capacitive, & Inductive Components , Aluminum , Electric contacts , Gold , N-type semiconductors , Vacuum deposition , Volt-ampere characteristics , Avalanches , Carrier injection , Charge carriers , Electrical faults , Graphs (charts) , Resolution

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