Semi-analytical solution for steady-periodic heat transfer of attached underground engineering envelope: Fid-Bau Portal

Semi-analytical solution for steady-periodic heat transfer of attached underground engineering envelope

Yuan, Yanping

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Semi-analytical solution for steady-periodic heat transfer of attached underground engineering envelope

Yuan, Yanping

Semi-analytical solution for steady-periodic heat transfer of attached underground engineering envelope

Yuan, Yanping

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Semi-analytical solution for steady-periodic heat transfer of attached underground engineering envelope

Contributors:

Yuan, Yanping (author) / Ji, Honghu / Du, Yanxia / Cheng, Baoyi

Published in:

Building and environment ; 43

Publication date:

2008

ISSN:

0360-1323

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

Local classification TIB: 275/6500/6605
BKL: 56.00 Bauwesen: Allgemeines

Yuan, Y. / Ji, H. / Du, Y. et al. | British Library Online Contents | 2008

Semi-analytical solution of roof-on-grade attached underground engineering envelope

Yuan, Y. / Ji, H. / Du, Y. et al. | British Library Online Contents | 2008

Semi-analytical solution of roof-on-grade attached underground engineering envelope

Yuan, Yanping | Online Contents | 2008

Experimental validation of the exact analytical solution to the steady periodic heat transfer problem in a PCM layer

Mazzeo, Domenico / Oliveti, Giuseppe / de Gracia, Alvaro et al. | BASE | 2017

Free access

Design of Attached Underground Structures

Cui, Zhen-Dong / Zhang, Zhong-Liang / Yuan, Li et al. | Springer Verlag | 2019