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Advances in Laser Direct Writing

Bloomstein, T. M. / Palmacci, S. T. / Mathews, R. H. / Nassuphis, N. / Ehrlich, D. J.

Abstract Recent improvements in the laser direct write technology are reviewed with particular emphasis on new applications for micromechanics and advanced electronic packaging. The laser stereo etching method has been scaled so as to permit the accurate three-dimensional etching of silicon in a chlorine ambient at a rate of one-half million cubic micrometers per second. Laser deposition processes have been found for the direct writing of metal interconnects on copper/polyimide substrates and similar materials for multichip modules. Apparatus to implement these processes on highly three-dimensional substrates has been developed.

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Advances in Laser Direct Writing

Bloomstein, T. M. / Palmacci, S. T. / Mathews, R. H. / Nassuphis, N. / Ehrlich, D. J.

Abstract Recent improvements in the laser direct write technology are reviewed with particular emphasis on new applications for micromechanics and advanced electronic packaging. The laser stereo etching method has been scaled so as to permit the accurate three-dimensional etching of silicon in a chlorine ambient at a rate of one-half million cubic micrometers per second. Laser deposition processes have been found for the direct writing of metal interconnects on copper/polyimide substrates and similar materials for multichip modules. Apparatus to implement these processes on highly three-dimensional substrates has been developed.

Advances in Laser Direct Writing

Bloomstein, T. M. / Palmacci, S. T. / Mathews, R. H. / Nassuphis, N. / Ehrlich, D. J.

Abstract Recent improvements in the laser direct write technology are reviewed with particular emphasis on new applications for micromechanics and advanced electronic packaging. The laser stereo etching method has been scaled so as to permit the accurate three-dimensional etching of silicon in a chlorine ambient at a rate of one-half million cubic micrometers per second. Laser deposition processes have been found for the direct writing of metal interconnects on copper/polyimide substrates and similar materials for multichip modules. Apparatus to implement these processes on highly three-dimensional substrates has been developed.

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Title:

Advances in Laser Direct Writing

Contributors:

Bloomstein, T. M. (author) / Palmacci, S. T. (author) / Mathews, R. H. (author) / Nassuphis, N. (author) / Ehrlich, D. J. (author)

Published in:

Laser Processing: Surface Treatment and Film Deposition ; 895-906

NATO ASI Series ; 307

Publication date:

1996-01-01

Size:

12 pages

ISBN:

978-94-009-0197-1 , 978-94-010-6572-6

ISSN:

DOI:

https://doi.org/10.1007/978-94-009-0197-1_49

Type of media:

Article/Chapter (Book)

Type of material:

Electronic Resource

Language:

English

Keywords:

Physics , Physics, general , Surfaces and Interfaces, Thin Films , Optics, Lasers, Photonics, Optical Devices , Characterization and Evaluation of Materials

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