A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Thermal Performance of Residential Buildings at Different Locations
https://orcid.org/http://orcid.org/0000-0002-2818-5831
The thermal dynamic thermal properties of the building envelop is an important parameter in thermal comfort studies. The present experimental study investigates the thermal performance parameters of the wall envelopes for the residential buildings at from different locations. The study involves actual field measurements of the buildings inside & outside wall surface temperatures. Time lag (TL) and Decrement factor (DF) are the major parameters that are being evaluated for building wall envelopes. The K-type thermocouple (as temperature sensor), integrated with microcontroller (Arduino) is used for acquiring data of measured temperatures from the building envelope. In addition to the temperature sensors, a Micro SD card adapter module (to store the surface temperature data) and a DS3231 RTC module (for date and timekeeping) have been used. As a result, the integrated device forms a low-cost data acquisition system (DAQ). The data is post processed for obtaining the time lag and decrement factor. The result shows that the time lag varies between 4.36 and 6.5 h and the decrement factor lies in the range of 0.213–1.750. These results help in understanding the thermal behavior of the building envelope in residential buildings.
Thermal Performance of Residential Buildings at Different Locations
https://orcid.org/http://orcid.org/0000-0002-2818-5831
The thermal dynamic thermal properties of the building envelop is an important parameter in thermal comfort studies. The present experimental study investigates the thermal performance parameters of the wall envelopes for the residential buildings at from different locations. The study involves actual field measurements of the buildings inside & outside wall surface temperatures. Time lag (TL) and Decrement factor (DF) are the major parameters that are being evaluated for building wall envelopes. The K-type thermocouple (as temperature sensor), integrated with microcontroller (Arduino) is used for acquiring data of measured temperatures from the building envelope. In addition to the temperature sensors, a Micro SD card adapter module (to store the surface temperature data) and a DS3231 RTC module (for date and timekeeping) have been used. As a result, the integrated device forms a low-cost data acquisition system (DAQ). The data is post processed for obtaining the time lag and decrement factor. The result shows that the time lag varies between 4.36 and 6.5 h and the decrement factor lies in the range of 0.213–1.750. These results help in understanding the thermal behavior of the building envelope in residential buildings.
Thermal Performance of Residential Buildings at Different Locations
https://orcid.org/http://orcid.org/0000-0002-2818-5831
The thermal dynamic thermal properties of the building envelop is an important parameter in thermal comfort studies. The present experimental study investigates the thermal performance parameters of the wall envelopes for the residential buildings at from different locations. The study involves actual field measurements of the buildings inside & outside wall surface temperatures. Time lag (TL) and Decrement factor (DF) are the major parameters that are being evaluated for building wall envelopes. The K-type thermocouple (as temperature sensor), integrated with microcontroller (Arduino) is used for acquiring data of measured temperatures from the building envelope. In addition to the temperature sensors, a Micro SD card adapter module (to store the surface temperature data) and a DS3231 RTC module (for date and timekeeping) have been used. As a result, the integrated device forms a low-cost data acquisition system (DAQ). The data is post processed for obtaining the time lag and decrement factor. The result shows that the time lag varies between 4.36 and 6.5 h and the decrement factor lies in the range of 0.213–1.750. These results help in understanding the thermal behavior of the building envelope in residential buildings.
Thermal Performance of Residential Buildings at Different Locations
Lecture Notes in Civil Engineering
Jayalekshmi, B. R. (editor) / Rao, K. S. Nanjunda (editor) / Pavan, G. S. (editor) / Himarani, C. K. (author) / Harish Gowda, D. S. (author) / Keerthanaram, A. R. (author) / Jashwanth Gowda, M. V. (author) / Balaji, N. C. (author)
International Conference on Sustainable Infrastructure: Innovation, Opportunities and Challenges ; 2023 ; Mangalore, India
2024-09-20
12 pages
Article/Chapter (Book)
Electronic Resource
English
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