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Fabrication, experimentation and numerical simulation of micro channel heat sink for enhancing thermal performance of electronic devices
https://orcid.org/http://orcid.org/0000-0001-6095-2853
The reliable functioning of next-generation electronic devices within their temperature limits is contingent upon the efficient removal of high heat flux. Interfaces between the device, heat spreaders, and heat sink contribute significantly to thermal resistance in conventional chip packages. The elimination of interface resistances can lead to a noteworthy decrease in overall thermal resistance by incorporating the heat sink directly into the heat-generating device. The current study involved the manufacturing, simulation and experimentation of a micro channel heat sink. The micro channel assembly is manufactured with dimensions of 50 × 50 × 3 mm. The length of micro channel is 35 mm having height and width of 0.2 mm with 58 channels. The experimentation and numerical simulation was done with considering the various parameters like mass flow rate, heat flux, and inlet temperature of nanofluid. The microchannel heat sink improved electronic device thermal performance in fabrication, experimentation, and numerical simulation. The heat sink lowered device temperatures and prevented overheating. Nanofluid at 0.3% volume and at a mass flow rate of 8 m/s, the heat transfer coefficient reaches a maximum value of 13,693.00 W/m2 K at input temperature of 35 °C. The comprehension of the heat sink's performance was enhanced subsequent to the simulations, which unveiled the fluid flow characteristics and heat transfer mechanisms within the microchannels.
Fabrication, experimentation and numerical simulation of micro channel heat sink for enhancing thermal performance of electronic devices
https://orcid.org/http://orcid.org/0000-0001-6095-2853
The reliable functioning of next-generation electronic devices within their temperature limits is contingent upon the efficient removal of high heat flux. Interfaces between the device, heat spreaders, and heat sink contribute significantly to thermal resistance in conventional chip packages. The elimination of interface resistances can lead to a noteworthy decrease in overall thermal resistance by incorporating the heat sink directly into the heat-generating device. The current study involved the manufacturing, simulation and experimentation of a micro channel heat sink. The micro channel assembly is manufactured with dimensions of 50 × 50 × 3 mm. The length of micro channel is 35 mm having height and width of 0.2 mm with 58 channels. The experimentation and numerical simulation was done with considering the various parameters like mass flow rate, heat flux, and inlet temperature of nanofluid. The microchannel heat sink improved electronic device thermal performance in fabrication, experimentation, and numerical simulation. The heat sink lowered device temperatures and prevented overheating. Nanofluid at 0.3% volume and at a mass flow rate of 8 m/s, the heat transfer coefficient reaches a maximum value of 13,693.00 W/m2 K at input temperature of 35 °C. The comprehension of the heat sink's performance was enhanced subsequent to the simulations, which unveiled the fluid flow characteristics and heat transfer mechanisms within the microchannels.
Fabrication, experimentation and numerical simulation of micro channel heat sink for enhancing thermal performance of electronic devices
https://orcid.org/http://orcid.org/0000-0001-6095-2853
The reliable functioning of next-generation electronic devices within their temperature limits is contingent upon the efficient removal of high heat flux. Interfaces between the device, heat spreaders, and heat sink contribute significantly to thermal resistance in conventional chip packages. The elimination of interface resistances can lead to a noteworthy decrease in overall thermal resistance by incorporating the heat sink directly into the heat-generating device. The current study involved the manufacturing, simulation and experimentation of a micro channel heat sink. The micro channel assembly is manufactured with dimensions of 50 × 50 × 3 mm. The length of micro channel is 35 mm having height and width of 0.2 mm with 58 channels. The experimentation and numerical simulation was done with considering the various parameters like mass flow rate, heat flux, and inlet temperature of nanofluid. The microchannel heat sink improved electronic device thermal performance in fabrication, experimentation, and numerical simulation. The heat sink lowered device temperatures and prevented overheating. Nanofluid at 0.3% volume and at a mass flow rate of 8 m/s, the heat transfer coefficient reaches a maximum value of 13,693.00 W/m2 K at input temperature of 35 °C. The comprehension of the heat sink's performance was enhanced subsequent to the simulations, which unveiled the fluid flow characteristics and heat transfer mechanisms within the microchannels.
Fabrication, experimentation and numerical simulation of micro channel heat sink for enhancing thermal performance of electronic devices
Int J Interact Des Manuf
Aglawe, Kapil R. (author) / Yadav, Ravindra K. (author) / Thool, Sanjeev B. (author)
2024-07-01
16 pages
Article (Journal)
Electronic Resource
English
Fabrication , Numerical simulation , Microchannel heat sink , Thermal performance , Electronic devices , Computational fluid dynamics (CFD) , Thermal management Engineering , Engineering, general , Engineering Design , Mechanical Engineering , Computer-Aided Engineering (CAD, CAE) and Design , Electronics and Microelectronics, Instrumentation , Industrial Design
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