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Experimental Investigation of Thermal Behavior of Un-treated and Chemically Treated PF-Based Wood Polymer Composite
The objective of this work is to study the thermal behavior of phenol formaldehyde used un-cured and chemically (5% and 10%) cured wood polymer composites under different ratios. The wood flour with PF resin thoroughly mixed with by using rotary barrel type whizzer according to calculated volume proportions. The thermal behavior of these WPCs showed that the thermic stability slightly increases with inclusion of wood flour content. The characteristics of raw material and mixing ratios contribute a prominent part in the thermal properties of fabricated samples of wood polymer composites. The limit for temperature should be 250 °C for practical applications. The two way ANOVA is used to optimize the experimental results.
Experimental Investigation of Thermal Behavior of Un-treated and Chemically Treated PF-Based Wood Polymer Composite
The objective of this work is to study the thermal behavior of phenol formaldehyde used un-cured and chemically (5% and 10%) cured wood polymer composites under different ratios. The wood flour with PF resin thoroughly mixed with by using rotary barrel type whizzer according to calculated volume proportions. The thermal behavior of these WPCs showed that the thermic stability slightly increases with inclusion of wood flour content. The characteristics of raw material and mixing ratios contribute a prominent part in the thermal properties of fabricated samples of wood polymer composites. The limit for temperature should be 250 °C for practical applications. The two way ANOVA is used to optimize the experimental results.
Experimental Investigation of Thermal Behavior of Un-treated and Chemically Treated PF-Based Wood Polymer Composite
J. Inst. Eng. India Ser. C
Ramesh, B. T. (author) / Ramesh, R. S. (author) / Bongale, Arunkumar (author)
Journal of The Institution of Engineers (India): Series C ; 104 ; 513-520
2023-06-01
8 pages
Article (Journal)
Electronic Resource
English
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