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Integration of a nonmetallic electrostatic precipitator and a wet scrubber for improved removal of particles and corrosive gas cleaning in semiconductor manufacturing industries
To remove particles in corrosive gases generated by semiconductor industries, we have developed a novel non-metallic, two-stage electrostatic precipitator (ESP). Carbon brush electrodes and grounded carbon fiber-reinforced polymer (CFRP) form the ionization stage, and polyvinyl chloride collection plates are used in the collection stage of the ESP. The collection performance of the ESP downstream of a wet scrubber was evaluated with KCl, silica, and mist particles (0.01–10 μm), changing design and operation parameters such as the ESP length, voltage, and flow rate. A long-term and regeneration performance (12-hr) test was conducted at the maximum operation conditions of the scrubber and ESP, and the performance was then demonstrated for 1 month with exhaust gases from wet scrubbers at the rooftop of a semiconductor manufacturing plant in Korea.
The results showed that the electrical and collection performance of the ESP (16 channels, 400 × 400 mm2) was maintained with different grounded plate materials (stainless steel and CFRP) and different lengths of the ionization stage. The collection efficiency of the ESP at high air velocity was enhanced with increases in applied voltages and collection plate lengths. The ESP (16 channels with 100 mm length, 400 × 400 mm2 × 540 mm with a 10-mm gap) removed more than 90% of silica and mist particles with 10 and 12 kV applied to the ESP at the air velocity of 2 m/s and liquid-to-gas ratio of 3.6 L/m3. Decreased performance after 13 hours of continuous operation was recovered to the initial performance level by 5 min of water washing. Moreover, during the 1-month operation at the demonstration site, the ESP showed average collection efficiencies of 97% based on particle number and 92% based on total particle mass, which were achieved with a much smaller specific corona power of 0.28 W/m3/hr compared with conventional ESPs.
Current electrostatic precipitators (ESPs) for the semiconductor manufacturing industry have economic drawbacks. For example, ESPs with metal components require the use of expensive anticorrosive metallic materials to protect against the corrosive gases produced in the semiconductor industry. This paper evaluates a nonmetallic, two-stage ESP that uses a carbon brush charger, carbon forced resin plate ground channels, and polyvinyl chloride collection plates into which aluminum sheets are inserted. This nonmetallic ESP can be used to remove particles and mists from highly corrosive gases in the semiconductor industry as well as in other industries.
Integration of a nonmetallic electrostatic precipitator and a wet scrubber for improved removal of particles and corrosive gas cleaning in semiconductor manufacturing industries
To remove particles in corrosive gases generated by semiconductor industries, we have developed a novel non-metallic, two-stage electrostatic precipitator (ESP). Carbon brush electrodes and grounded carbon fiber-reinforced polymer (CFRP) form the ionization stage, and polyvinyl chloride collection plates are used in the collection stage of the ESP. The collection performance of the ESP downstream of a wet scrubber was evaluated with KCl, silica, and mist particles (0.01–10 μm), changing design and operation parameters such as the ESP length, voltage, and flow rate. A long-term and regeneration performance (12-hr) test was conducted at the maximum operation conditions of the scrubber and ESP, and the performance was then demonstrated for 1 month with exhaust gases from wet scrubbers at the rooftop of a semiconductor manufacturing plant in Korea.
The results showed that the electrical and collection performance of the ESP (16 channels, 400 × 400 mm2) was maintained with different grounded plate materials (stainless steel and CFRP) and different lengths of the ionization stage. The collection efficiency of the ESP at high air velocity was enhanced with increases in applied voltages and collection plate lengths. The ESP (16 channels with 100 mm length, 400 × 400 mm2 × 540 mm with a 10-mm gap) removed more than 90% of silica and mist particles with 10 and 12 kV applied to the ESP at the air velocity of 2 m/s and liquid-to-gas ratio of 3.6 L/m3. Decreased performance after 13 hours of continuous operation was recovered to the initial performance level by 5 min of water washing. Moreover, during the 1-month operation at the demonstration site, the ESP showed average collection efficiencies of 97% based on particle number and 92% based on total particle mass, which were achieved with a much smaller specific corona power of 0.28 W/m3/hr compared with conventional ESPs.
Current electrostatic precipitators (ESPs) for the semiconductor manufacturing industry have economic drawbacks. For example, ESPs with metal components require the use of expensive anticorrosive metallic materials to protect against the corrosive gases produced in the semiconductor industry. This paper evaluates a nonmetallic, two-stage ESP that uses a carbon brush charger, carbon forced resin plate ground channels, and polyvinyl chloride collection plates into which aluminum sheets are inserted. This nonmetallic ESP can be used to remove particles and mists from highly corrosive gases in the semiconductor industry as well as in other industries.
Integration of a nonmetallic electrostatic precipitator and a wet scrubber for improved removal of particles and corrosive gas cleaning in semiconductor manufacturing industries
Kim, Hak-Joon (author) / Han, Bangwoo (author) / Kim, Yong-Jin (author) / Yoa, Seok-Jun (author) / Oda, Tetsuji (author)
Journal of the Air & Waste Management Association ; 62 ; 905-915
2012-08-01
11 pages
Article (Journal)
Electronic Resource
Unknown
| Taylor & Francis Verlag | 1999
| Taylor & Francis Verlag | 2011
| Engineering Index Backfile | 1956
Electrostatic precipitator manual
| TIBKAT | 1982