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Particulate Matters in Silicon Carbide Whiskers
Commercially available silicon carbide whiskers contain particulate contamination. Levels of this contamination, its size distribution, and its impact on the strength and toughness of a composite were examined. An optical microscopy technique was developed to evaluate particulate levels in the whiskers. Moreover, a simple technique (borrowed from the fillers and extenders industry) allowed rapid (less than 10 min) measurement of levels of large particles in the SiC whiskers. Effects of SiC particulate size and concentrations on the strength and toughness of a composite were measured using a borosilicate glass matrix (Corning code 7740). Total SiC was held constant at 20 vol% while the ratio of particles to whiskers was varied.
Particulate Matters in Silicon Carbide Whiskers
Commercially available silicon carbide whiskers contain particulate contamination. Levels of this contamination, its size distribution, and its impact on the strength and toughness of a composite were examined. An optical microscopy technique was developed to evaluate particulate levels in the whiskers. Moreover, a simple technique (borrowed from the fillers and extenders industry) allowed rapid (less than 10 min) measurement of levels of large particles in the SiC whiskers. Effects of SiC particulate size and concentrations on the strength and toughness of a composite were measured using a borosilicate glass matrix (Corning code 7740). Total SiC was held constant at 20 vol% while the ratio of particles to whiskers was varied.
Particulate Matters in Silicon Carbide Whiskers
Smothers, William (editor) / Lee, Kenneth W. (author) / Sheargold, Stephen W. (author)
1987-01-01
10 pages
Article/Chapter (Book)
Electronic Resource
English
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