Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Advances in electronic packaging technologies to temperatures as high as 500C (invited)
Advances in electronic packaging technologies to temperatures as high as 500C (invited)
Advances in electronic packaging technologies to temperatures as high as 500C (invited)
Grzybowski, R. R. (Autor:in) / Golecki, I. / Engineering Foundation
High-temperature electronic materials, devices and sensors conference ; 1998 ; San Diego; CA
01.01.1998
9 pages
IEEE cat no 98EX132
Aufsatz (Konferenz)
Englisch
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