Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Materials selection issues for high operating temperature (HOT) electronic packaging (invited)
Materials selection issues for high operating temperature (HOT) electronic packaging (invited)
Materials selection issues for high operating temperature (HOT) electronic packaging (invited)
Gallagher, C. (Autor:in) / Shearer, B. (Autor:in) / Matijasevic, G. (Autor:in) / Golecki, I. / Engineering Foundation
High-temperature electronic materials, devices and sensors conference ; 1998 ; San Diego; CA
01.01.1998
10 pages
IEEE cat no 98EX132
Aufsatz (Konferenz)
Englisch
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