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A Tin-based Composite Solder Reinforced by Nano-sized Particulates and its Soldering Ability

Zhang, X. P. / Shi, Y. W. / Ye, L. / Mai, Y.-W.

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A Tin-based Composite Solder Reinforced by Nano-sized Particulates and its Soldering Ability

Zhang, X. P. / Shi, Y. W. / Ye, L. / Mai, Y.-W.

A Tin-based Composite Solder Reinforced by Nano-sized Particulates and its Soldering Ability

Zhang, X. P. / Shi, Y. W. / Ye, L. / Mai, Y.-W.

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Titel:

A Tin-based Composite Solder Reinforced by Nano-sized Particulates and its Soldering Ability

Beteiligte:

Zhang, X. P. (Autor:in) / Shi, Y. W. (Autor:in) / Ye, L. (Autor:in) / Mai, Y.-W. (Autor:in) / Ye, L. / Mai, Y. W. / Su, Z.

Kongress:

4th, Asian-Australasian conference on composite materials; Composites technologies for 2020 ; 2004 ; University of Sydney

Erschienen in:

Asian-Australasian conference on composite materials; Composites technologies for 2020 ; 645-650

PROCEEDINGS OF THE ASIAN-AUSTRALASIAN CONFERENCE ON COMPOSITE MATERIALS

Erscheinungsdatum:

01.01.2004

Format / Umfang:

6 pages

ISBN:

1855738317

Medientyp:

Aufsatz (Konferenz)

Format:

Sprache:

Englisch

Schlagwörter:

Composite materials , Composites technologies , ACCM

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